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  1/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. system motor driver ics for cd / dvd / blu-ray drive and recorder system motor driver ic for half height drive (sensor less) bd7755rfv description bd7755rfv are ics, developed for the spindle motor, actuator coil, tilt coil, stepping motor, sa stepping motor and the loading motor drive of the desktop blu-ray drive and blu-ray re corder. spindle driver adopted sensorless drive system, and the hall sensor (3 pieces) of the motor pos ition detection is not needed, it is suitable for making of flexible cable conserve wiring and the reductions of external parts. the low rotation mode is built in, and stability and low-speed a rotation is achieved. the spindle, stepping and sa stepping use power mo sfet to reduce power consumption and the actuator, tilt, and loading driver use a linear btl drive system to reduce noise. features 1) the low-speed stability rotation is achieved with built-in the low rotation mode. 2) the hall sensor is unnecessary according to 3 aspect sensorless drive system. 3) the spindle motor driver achieves stability high speed start by rohm's own energizing method. 4) highly effective spindle, stepping an d sa stepping is achieved by pwm contro l driver. and the output current detection resistance of stepping and sa stepping is unnecessary by built-in internal detection circuit. 5) the actuator, tilt and loading driver achi eve low noise by using linear btl drive system. 6) on/off of loading and other channel s, brake mode of spindle driver and standby mode are selectable by the two control terminals. 7) built-in thermal-shut down circuit. 8) improved heat radiation ef ficiency utilizing htssop package. applications for desktop blu-ray drive absolute maximum ratings parameter symbol ratings unit power mos power supply voltage 1 spvm, slvm 15 #1 v power mos power supply voltage 2 savm 7 #2 v preblock/btl power block power supply voltage vcc, avm, ldvm 15 v pwm control block power supply voltage dvcc 7 v power dissipation pd 1.5 #3 w operating temperature ra nge topr -20 ~ 70 storage temperature tstg -55 ~ 150 junction temperature tjmax 150 #1 power mos output terminals (40~43pin, 46 48pin) are contained. #2 power mos output terminals (35~38pin) are contained. #3 pcb mounting (70mmx70mmx1.6mm, occupied copper foil is less than 3%, glass epoxy standard board). reduce by 12mw/ over 25 no.10012eat01
technical note 2/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv
technical note 3/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv
technical note 4/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv
technical note 5/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv
technical note 6/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv equivalent-circuit diagram of the terminals three-phase motor driver output bemf voltage detection input 52 47 48 50 45 1 2 51 53pin 5k 5k 10k 5k 52pin 10k pwm driver output sled1,2 pwm driver ou tput sa1,2 btl driver output fc,tk,tl 44 40 42 41 43 39 32 35 37 36 38 39 23 15 17 19 13 18 16 14 btl driver output ld btl driver input fc,tk,tl,ld pwm driver input sled1,2 11 13 12 10 200 9 20 21 22 25pin 53pin 200 30 31 27pin 53pin pwm driver input sa1,2 pwm driver input spindle spindle current limit input 28 29 27pin 53pin 62.6k 200 8 27pin 53pin 54 52pin 53pin
technical note 7/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv equivalent-circuit diagram of the terminals prtflg, fg signal output sldetout signal output sled inner detection input 30 25pin 26 3 53pin 30 27pin 34 53pin 33 10k 10k 25pin 53pin actuator current limit input contro l signal reference voltage input 7 5k 10k 25pin 53pin 200 24 2ch 6ch 62.6k 50k 50k 10k 25pin 53pin 2ch control signal input (ctl1) control signal input (ctl2, lrpm) 50k 50k 20k 180k 20k 270k 4 53pin 25pin 53pin 5 6 50k 150k 50k 150k 120k 100k 150k 50k 50k 150k 25pin 53pin 25pin 53pin 53pin
technical note 8/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv test circuit 16 14 39 41 42 43 27 26 25 24 22 21 20 19 18 17 11 10 9 8 7 6 5 4 3 2 1 44 45 46 47 48 49 50 51 52 53 54 28 29 30 31 32 33 34 35 36 37 38 40 15 13 12 23 t.s.d bemf detecter logic curr. feed level shift curr. limit osc pre logic pre logic ff ff osc osc curr. limit curr.feed curr.feed level shift level shift pre logic pre logic ff ff osc osc curr. limit curr.feed curr.feed detecter 26.5k 26.5k 160k 160k 26.5k 26.5k 160k 160k avm/2 26.5k 26.5k 160k 160k 26.5k 26.5k 160k 160k avm/2 26.5k 26.5k 160k 160k 26.5k 26.5k 160k 160k avm/2 80k 40k 80k 80k 40k 80k ldvm/2 40k 2 protect stby brake control lrpm prtlim c_out c_com ctl1 ctl2 lrpm prtlim spin ldin ldvm ldo+ ldo- fco+ fco- tlo+ tlo- agnd tko+ tko- tlin fcin tkin avm vc vcc prtflg dvcc fg gnd splim spvm n.c. spgnd v u n.c. slvm sao2- sao2+ sao1- sao1+ sl/sagnd slo2- slo2+ slo1- slo1+ sldetout sldet savm slin2 slin1 sain2 sain1 com w iqdv dvcc vc tkin tlin fcin avm fc + - out tl + - out tk + - out ld + - out ldin iqvc vcc 100k dvcc ctl1 ctl2 out u v w sp slvm + - out slo2 + - out slo1 + - out sao2 + - out sao1 vslin2 vslin1 vsain1 vsain2 savm 100k dvcc vspin com cout 12 ccom ccom lrpm ldvm 12 4.7k isplim 12 2k vsldet 100k dvcc spvm level shift level shift 62.6k 62.6k out- out+ out-a il rl v vo 47h sw-rl 2 1 2 1 2 1 il sw-il sw-il uw v outsp 2 1 2 1 rlsp rlsp rlsp sw-rl sw-rl 47h 47h 47h 2-v 2-w 2-u il sw-il 1
technical note 9/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv functional description 1-1. driver logic control terminal 1and 2 (ctl1,2) all drivers and spindle-drive braking modes can be switched on/off by inputting combinations of h-level signal (higher than 2.5v and lower than 3.7v), l-level signal (lower than 0.5v) and hiz signal (open) to these terminals. ? driver on/off logic table mode ctl1 ctl2 sp sl(2ch) act(3ch) sa(2ch) loading l, hiz l, hiz h l h hiz l, hiz h :on h h :off stand-by mode the ic is brought into stand-by mode, and its power dissipation can be limited. drivers muting all output channels, except the loading and sled motor are muted and their outputs are turned off. sa mute mode the loading and sa driver are muted. ? loading off mode only the loading driver is muted. ? spindle braking mode table mode ctl1 ctl2 spin > vc spin < vc h hiz forward-rotation mode reverse-rotation braking mode (lrpm=l) l, hiz h short-circuit braking mode h h reverse-rotation braking mode (lrpm=l) ? reverse-rotation braking mode (spindle) when spin < vc, all output are shorted to spvm in 4500rpm (typ.) or more, in less than 4500rpm (typ.) the output become reverse-rotation braking mode. rotation speed is less than 140rpm when spin < vc, all the output are shorted to spvm. (however, the above-mentioned rotational speed is expressed in the case of 12pole motor.) short-circuit braking mode (spindle) all the spindle driver outputs are shorted to spvm when spin < vc. 1-2.spindle output mode the spindle output changes as follows by the setting of lrpm and spin. (ctl1=h,ctl2=h or hiz) rotation speed 0rpm 400rpm 4500rpm normal mode lrpm=low spin>vc 120 energizing 150 energizing spinvc 120 energizing spin technical note 10/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv 2. output limit for spindle (splim) 3. torque command (spin) (slin1,2) (sain1,2) the relation between (the torque command inputs) and (iosp or i oo) is expressed in the figure below: the gain is defined by the inclination between two points. (please exclude the dead zone from the input voltage when calculating iop. ) vc iop spin slin1,2 sain1,2 forward rotation input dead zone - input dead zone + gain 4. fg output (fg) 3fg output begins after 900 degrees in electric angle, after the start m ode ends and the bemf detection starts. when the rotational speed becomes 24rpm (max.) or less in case of brake, the fg output is fixed to high. the above-mentioned rotation speed applies to the 12 pole motor. 5. input/output timing chart bemfu bemfv bemfw vc spin mid source sink u ) forward -rotation mode ) reverse-rotation braking mode ) short-circuit braking mode mid source sink v mid source sink w
technical note 11/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv 6. protect system 1 it is a function to mute the actuator outputs when the ic out puts the current more than the setting threshold value iprtlim for 1.2sec because of the protection for th e focus, the tracking, and the tilt coil. outputs are muted similarly when the output current of two or three chs conti nuously exceed the threshold for 1.2sec. it returns to normal operation by setting ctl2=l. iprtlim = a rprtlim( ) (a) a = 8750 prtflg(output) actuator output (fco/tko/tlo) h off l active min. typ. max. unit time until protection functi on operates 1.0 1.2 1.4 s current between fco outputs 0 current between tlo outputs current between tko outputs ctl2 0 0 low high fcin1 0 current between fco outputs current between tlo outputs current between tko outputs ctl2 0 fcin1 0 0 threshold current 0 threshold current low high threshold current threshold current threshold current threshold current 1.2sec mute 1.2sec mute reset 7. protect system 2 function to protect against destruction of output te rminal when output pin connects to gnd or vcc. prtflg(output) spindle, sled motor driver output h off l active ? spindle, sled motor ? when sink side power transistor has been turned on, if the output voltage (spvm/2&slvm/2 or more) are detected, the channel concerned will be turned off. ? when source side power transistor has been turned on, if the output voltage (spvm/2&slvm/2 or less ) are detected, the channel concerned will be turned off.
technical note 12/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv 8. inner detection function bemf of the motor is monitored according to timing for the sled input signal to pass vc, and sled is detected reaching the inner. the judgment voltage of bemf can be set according to the voltage input to the terminal sldet. if bemf below the judgment voltage is detected twice continuously, it becomes sldetout=l. t he inner detection function can be turned off with sldet<0.5v. when the motor starts, the terminal slde tout might become l because bemf is unstable. please take measures such as installing the time of t he mask when it starts for the detection prevention. judgment voltage vbemf =2.1 (sldet - vc) + 0.49 vc slin1 slin2 sldetout sldet x stop motor instability :detection point bemf < vbemt :detection point bemf > vbemt 9. pwm oscillation frequency the pwm oscillation for driving the spindle and sled is free running. the sled and sa oscillating frequency is 100khz (typ.) the spindle oscillating frequency is 167khz (typ.) 10. muting functions a) vc-drop muting when the voltage at vc terminal drops to a value lower than 0.7v (typ.), the outputs of all the channels are turned off. set the vc terminal voltage higher than 1.0v. b) vcc-drop muting when the voltage at dvcc terminal and vcc terminal drop to lower than 3.85v (typ.), the outputs of all the channels are turned off. c) over voltage protection circuit when the voltage at spvm terminal exceed 14.1v (typ .), only the spindle block output is turned off. 11. thermal-shut down thermal-shutdown circuit (over-temperature protection circuit) is built in to prevent the ic from thermal breakdown. use the ic according to the thermal loss allowed in the package. in case the ic is left running over the allowed loss, the junction temperature rises, and the thermal-shutdown circuit works at a junction temperature of 175 (typ.) (all other channel outputs are turned off) when the junction temperature drops to 150 (typ.) the ic resumes operation.
technical note 13/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv notes for use 1. absolute maximum ratings we are careful enough for quality control about this ic. so, t here is no problem under normal op eration, excluding that it exceeds the absolute maximum ratings. however, this ic might be destroyed when the absolute maximum ratings, such as impressed voltages (vcc, pvcc) or the operating temperature range(topr), is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified. pl ease take into consideration the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed. 2. power supply line due to switching and emi noise generated by magnetic component s (inductors and motors), using electrolytic and ceramic suppress filter capacitors(0.1 f) close to the ic power input terminals (vcc and gnd) is recommended. please note: the electrolytic capacitor value decreases at lower temperatures. current rush might flow momentarily by the order of turning on the power supply and the delay in ic with two or more power supplies. note the capacity of the power supply coupling, width and drawing the power supply and the gnd pattern wiri ng.please make the power supply lines (where large current flow) wide enough to reduce the resistance of the power suppl y patterns, because the resistance of power supply pattern might influence the usual operati on (output dynamic range etc?). 3. gnd line the ground line is where the lowest potential and transient voltages are connected to the ic. 4. thermal design do not exceed the power dissipation (pd) of the package s pecification rating under actual operation, and please design enough temperature margins. 5. short circuit mode between terminals and wrong mounting do not mount the ic in the wr ong direction and be careful about the reverse-con nection of the power connector. moreover, this ic might be destroyed when the dust short the terminals between them or gnd 6. radiation strong electromagnetic radiati on can cause operation failures. 7. aso(area of safety operation.) do not exceed the maximum aso and the absolute maximum ratings of the output driver. 8. tsd(thermal shut-down) the tsd is activated when the juncti on temperature (tj) reaches 175 (with 25 hysteresis), and t he output terminal is switched to hi-z. the tsd circuit aims to intercept ic from high temperature. the guarantee and protection of ic are not purpose. therefore, please do not use this ic after tsd circ uit operates, nor use it for as sumption that operates the tsd circuit. 9. inspection by the set circuit board the stress might hang to ic by connecting the capacitor to the terminal with low impedance. then, please discharge electricity in each and all process. moreover, in the inspec tion process, please turn off t he power before mounting the ic, and turn on after mounting the ic. in addition, please take into consideration the counte rmeasures for electrostatic damage, such as giving the earth in assembly process, transportation or preservation.
technical note 14/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv 10. earth wiring pattern this ic is a monolithic ic, and has p + isolation and p substrate for the element separation. therefore, a parasitic pn junction is firmed in this p-layer and n-layer of each element. for instance, the resistor or t he transistor is connected to th e terminal as shown in the figure below. when the gnd voltage poten tial is greater than the voltage potential at terminals a or b, the pn junction operates as a parasitic diode. in additi on, the parasitic npn transistor is formed in said parasitic diod e and the n layer of surrounding elements close to said parasitic diode. these parasitic elements are formed in the ic because of the voltage relation. the parasitic element operati ng causes the wrong operation and destruction. therefore, please be careful so as not to operate the parasitic element s by impressing to input terminals lower voltage than gnd(p substrate). please do not apply the voltage to the input termi nal when the power-supply voltage is not impressed. moreover, please impress each input terminal lower than the power-suppl y voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage is impressing. simplified structure of ic 11. earth wiring pattern use separate ground lines for control signals and high current power driver outputs. because these high current outputs that flows to the wire impedance changes the gnd voltage fo r control signal. therefore, each ground terminal of ic must be connected at the one point on the set circuit board. as for gnd of external parts, it is similar to the above-mentioned. 12. reverse-rotation braking in the case of reverse-rotation braking from high speed ro tation, pay good attention to reverse electromotive force. furthermore, fully check the voltage to be applied to the out put terminal and consider the revolutions applied to the reverse-rotation brake. 13. about the capacitor between spvm and spgnd the capacitor between spvm and spgnd absorbs the change in a steep voltage and the cu rrent because of the pwm drive, as a result, there is a role to suppress the disorder of the spvm voltage. however, the effect falls by the influence of the wiring impedance etc, if the capacitor becomes far fr om ic. please examine the capacitor between spvm and spgnd to arrange it near ic. terminal-a parasitic element gnd p + p terminal-a terminal-b gnd p p-substrate cb gnd e e c b gnd surrounding elements resistor transistor(npn) p + p + p + p-substrate parasitic element parasitic element parasitic element terminal-b
technical note 15/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv application circuit , 41 gnd c_out c_com ctl1 ctl2 lrpm prtlim spin ldin ldvm ldo+ ldo- fco+ fco- tlo+ tlo- agnd tko+ tko- tlin fcin tkin avm vc vcc prtflg dvcc splim fg spvm n.c. spgnd v u n.c. slvm sao2- sao2+ sao1- sao1+ sl/sagnd slo2- slo2+ slo1- slo1+ sldetout sldet savm slin2 slin1 sain2 sain1 com w t.s.d bemf detecter logic curr. feed level shift curr. limit osc pre logic pre logic ff ff osc osc curr. limit curr.feed curr.feed level shift level shift pre logic pre logic ff ff osc osc curr. limit curr.feed curr.feed detecter 26.5k 26.5k 160k 160k 26.5k 26.5k 160k 160k avm/2 26.5k 26.5k 160k 160k 26.5k 26.5k 160k 160k avm/2 26.5k 26.5k 160k 160k 26.5k 26.5k 160k 160k avm/2 80k 40k 80k 80k 40k 80k ldvm/2 40k 2 protect stby brake control lrpm prtlim m stm stm level shift level shift 62.6k 62.6k 1000pf 1.5k 16 14 27 26 25 24 22 21 20 19 18 17 11 10 9 8 7 6 5 4 3 2 1 15 13 12 23 39 42 43 44 45 46 47 48 49 50 51 52 53 54 28 29 30 31 32 33 34 35 36 37 38 40
technical note 16/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv connecting wires of application board
technical note 17/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv pattern drawing of application board power dissipation reduction power dissipation : pd (w) 25 50 75 100 125 150 0 ambient temperature : ta () 2.0 1.0 1.5w *70mm 70mm, t=1.6mm, occupied c opper foil is less than 3%, glass epoxy mounting.
technical note 18/18 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. bd7755rfv ordering part number b d 7 7 5 5 r f v - e 2 part no. part no. 7755 package rfv: htssop-b54r packaging and forming specification e2: embossed tape and reel (htssop-b54r) (unit : mm) htssop-b54r 0.850.05 0.080.05 0.65 1.0max 0.22 +0.05 - 0.04 0.08 m s 0.08 54 28 27 1 18.50.1 (5.0) (6.0) 9.50.2 7.50.1 0.8 (max 18.85 include burr) 1pin mark 0.50.15 1.00.2 0.17 +0.05 - 0.03 s 4 + 6 ? 4 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1500pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.


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